老吴 发表于 2016-5-6 11:06:38

PCB基板厚度(包括芯板及半固化片)

PCB板材厚度规格：
0.5mm，0.7mm，0.8mm，1.0mm，1.2mm，1.5mm，1.6mm，2.0mm，2.4mm，3.2mm，6.4mmPCB板上铜箔的厚度规格： 18um, 25um,35um, 70um和105um常用半固化片规格：型号10802116L2116A2116H15007628L7628A7628H7628M厚mil344.55677.59.38
板厚一般分为含铜和不含铜两种厚度
一．含铜厚度：规格配料结构规格配料结构0.1H/H1×1061.31/16×76280.21/11×2116H/H7×7628H/12×10801.42/27×7628H/H1×15061/17×7628T/T1×7628H/H7×76282/21×1061.52/27×76280.32/21×15061/18×7628H/21×7628H/H8×76281/12×2116T/T8×7628H/12×21161.62/28×7628H/H1080+2116+10801/18×7628T/T1080+2116+1080H/H8×76280.42/21080+2116+10801.72/28×76281/11080+7628+1080H/H2×76281/19×7628T/T2×7628H/H9×76280.52/22×76281.82/29×76281/17628+1080+76281/19×7628H/H7628+1080+7628H/H9×76280.62/27628+1080+76281.92/29×76281/13×76281/110×7628H/H3×7628H/H10×76280.72/23×76282.02/210×76281/12116+2×7628+21161/110×7628H/H1080+3×7628+1080H/H11×76280.82/21080+3×7628+10802.21/111×76281/14×7628H/H12×7628H/H4×76282.32/212×76280.92/24×76281/112×76281/12×7628+1080+2×7628H/H12×7628H/H2×7628+2116+2×76282.42/212×76281.02/22×7628+2116+2×76281/113×76281/15×7628H/H13×7628H/H5×76282.52/213×76281.12/25×76281/113×76281/15×7628H/H13×7628H/H6×76283.02/216×76281.22/26×76281/116×76281/16×7628H/H16×7628H/H6×76283.21/117×7628 2/217×7628

二．不含铜厚度厚度mil厚度mm配料结构备注20.050
1×106
不含2OZ铜箔30.075~0.076
主:1×1080次:1×1086
不含2OZ铜箔厚度mil厚度mm配料结构备注40.10~0.102
主:1×2116次:1×3313或2×106或1×2113或1×2313或1080+106
50.127
主:1×2116次:2×1080
60.150~0.152
主:1×1506次:2×1080
70.178
主:1×7628次:1080+2116
80.200~0.203
主:1×7628次:2×2116或2×2113
90.228~0.230
2×2116
100.25~0.254
2×2116
110.280
主:1080+2116+1080次:2×2165
120.300~0.305
主:2×1506次:2116+1080+2116
13
0.33
主:1080+7628+1080次:2×1506
140.356~0.36
2×7628
150.38
2×7628
160.406~0.41
主:2×7628次:3×2116
170.43
主:7628+1080+7628次:2×7628
180.457~0.46
7628+1080+7628
190.48
7628+2116+7628
200.508~0.51
主:7628+2116+7628次:7628+2×1080+7628或3×7628
210.53
3×7628
220.56
3×7628
230.58
3×7628
240.60~0.61
主:3×7628次:2116+2×7628+2116
250.64
主:3×7628次:2116+2×7628+2116
260.66
1080+3×7628+1080
270.69
1080+3×7628+1080
280.71~0.711
主:4×7628次:4×7628
300.76
4×7628
310.79~0.80
4×7628

友情备注：1 foot = 12 inch = 304.8 mm1inch = 25.4 mm1 mil=0.0254 mm
1inch=1000 mil
1OZ=28.375g   1 OZ铜箔其真正厚度为1.38mil或35μm

一、芯板、半固化片规格：
1．生益芯板常见规格：
0.1mm（含铜厚）
0.2mm~5.12
0.3mm~9.06
0.4mm~12.99   
0.5mm~16.93
0.6mm~20.87
0.7mm~24.8
0.8mm~28.74
0.9mm~36.61
1mm~44.49
1.2mm~52.36
1.5mm~56.3
1.6mm~60.24
2mm~75.98
2.4mm~91.73
2．半固化片：
1080~3.0mil
2116~4.2mil
7628~7.0mil
3．流胶厚：
1080~2.5mil
7628~6.5mil
0.14mm=2*1080
0.21mm=2*2116
    0.24mm=7628+1080
    0.36mm=2*7628
0.4mm=2*7628+1080
二、常用半固化片在不同铜厚、不同图形厚度变化：
1． HOZ

Copper/gnd
Gnd/gnd
Copper/signal
Gnd/signal
Signal/signal76287.37.06.86.76.621164.64.44.24.03.833133.93.83.73.53.310802.82.62.52.42.27628H7.67.37.17.06.92116H4.94.74.54.34.13313H4.14.03.93.73.51018H2.92.72.62.52.37628C7.16.86.66.56.43313C3.73.63.53.23.1


2．1OZ

Copper/gnd
Gnd/gnd
Copper/signal
Gnd/signal
Signal/signal76287.16.86.66.56.421164.54.34.13.93.733133.83.73.63.43.210802.82.62.52.42.27628H7.47.16.96.86.72116H4.84.64.44.24.03313H4.03.93.83.63.41018H2.92.72.62.52.37628C6.96.66.46.36.23313C3.63.53.43.23.0

3．2OZ

Copper/gnd
Gnd/gnd
Copper/signal
Gnd/signal
Signal/signal76286.86.56.36.16.021164.24.03.83.53.333133.53.43.33.12.810802.62.42.32.11.97628H7.16.86.66.46.32116H4.54.34.13.83.63313H3.73.63.53.33.01018H2.72.52.42.22.07628C6.66.36.15.95.83313C3.33.23.12.92.6

4．3OZ

Copper/gnd
Gnd/gnd
Copper/signal
Gnd/signal
Signal/signal76286.56.26.05.75.621164.03.83.63.23.033133.33.23.12.82.510802.42.22.11.81.67628H6.86.56.36.05.92116H4.34.13.93.53.33313H3.53.43.33.02.71018H2.52.32.21.91.77628C6.36.05.85.55.43313C3.13.02.92.62.3

注：Gnd为65%以上的大铜箔，H为高树脂含量，C为低树脂含量。
S0401粘结片压合厚度（100％残铜率）file:///C:/Users/ADMINI~1/AppData/Local/Temp/msohtmlclip1/01/clip_image001.gif指标 规格树脂含量压合厚度μm/±20μm压合厚度Mil10671±3502.0±0.41080L61±3712.8±0.41080A64±3783.1±0.41080H68±3903.5±0.42116L50±31134.4±0.62116A52±31204.7±0.62116H56±31335.2±0.6331355±31004.0±0.67628L41±31857.3±0.87628A43±31957.7±0.87628M46±32108.3±0.87628H50±32309.1±0.81506A45±31606.3±0.81506H49±31756.9±0.8
S0701粘结片压合厚度（残铜率100%）file:///C:/Users/ADMINI~1/AppData/Local/Temp/msohtmlclip1/01/clip_image001.gif指标 规格树脂含量压合厚度μm/±20μm压合厚度Mil10671±3512.0±0.41080L61±3722.8±0.41080A64±3803.1±0.41080H68±3923.6±0.42116L50±31154.5±0.62116A52±31214.8±0.62116H56±31355.3±0.6331355±31024.0±0.67628L41±31887.4±0.87628A43±31987.8±0.87628M46±32138.4±0.87628H50±32359.3±0.81506A45±31626.4±0.81506H48±31756.9±0.8S1000B粘结片压合厚度（残铜率100%）file:///C:/Users/ADMINI~1/AppData/Local/Temp/msohtmlclip1/01/clip_image001.gif指标 规格树脂含量压合厚度μm/±20μm压合厚度Mil10671±3471.9±0.41080L63±3712.8±0.41080A66±3783.1±0.41080H68±3833.3±0.42116L52±31124.4±0.62116A55±31214.8±0.62116H58±31325.2±0.6331355±3943.7±0.67628L43±31857.3±0.87628A46±31987.8±0.87628M48±32078.1±0.87628H50±32188.6±0.81506A45±31515.9±0.81506H48±31626.4±0.8S0155粘结片压合厚度（100%残铜率）file:///C:/Users/ADMINI~1/AppData/Local/Temp/msohtmlclip1/01/clip_image001.gif指标 规格树脂含量压合厚度μm/±20μm压合厚度Mil10671±3491.9±0.41080L62±3722.8±0.41080A65±3793.1±0.41080H68±3883.6±0.42116L51±31144.5±0.62116A53±31204.7±0.62116H56±31305.1±0.6331356±31004.0±0.67628L42±31877.4±0.87628A44±31967.7±0.87628M46±32058.1±0.87628H50±32278.9±0.81506A45±31566.1±0.81506H48±31686.6±0.8
以上压合厚度谨供贵司参考，因为具体压合后厚度还与贵司生产的PCB的铜厚、线路等有关，所以以上数据仅为贵司提供一个参考，制成PCB后的具体数据还以贵司实测值为准。

lozgwn 发表于 2016-5-6 13:01:11

好，学习下，

ok407371195 发表于 2016-5-6 15:20:46

君皓 发表于 2016-5-7 08:12:11

xzh 发表于 2016-5-7 08:26:26

不是很能理解

sk红酒杯 发表于 2016-5-7 09:27:22

学习学习

xiefeifjoo6 发表于 2016-5-7 10:02:16

不错的参考资料啊

myntpcb 发表于 2016-5-7 10:19:34

很好的资料。
谢谢老大。

ycy 发表于 2016-5-8 09:25:13

学习了~谢谢分享`
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